Description
With the HDG200 developers are targeting wireless sensors for industrial and home control, AMR for smart and green energy control, remote device management such as location tracking and the growing segment of equipment and consumer electronic devices such as Portable Media devices, IP-radio, home security, wireless speakers and IP audio devices.
The HDG200 SiP format, with its complete system functionality, means quicker design cycles, lower risk and simplified manufacturing, all in a very small package (8 × 8 mm). Lack of external components simplifies assembly test and reduces yield loss. The HDG200 SiP delivers a complete and fully tested and trimmed implementation of 802.11b/g/n functionality. The HDG200 solution is Pre- tested, calibrated and certified resulting in lowest possible production and system cost.
Key features
- Ultra low power consumption solution for embedded applications
- Low Cost
- External interfaces SDIO and SPI
- High RF output TX power (+17dBm) and RX sensitivity
- Supports multiple SW features incl 802.11e/i (Security, Quality of Service)
- Low number of external discrets needed: 19 + antenna
- External chips:40MHz (or from system)
- Pre-calibrated and programmed with MAC address
- No RF trimming needed
- 32KHz from host CPU or internal
- WEP and AES hardware encryption accelerator up to 128 bit for WEP and WPA2 support
- On-chip RF filter for the ISM band 2.4GHz
- An internal 32 kHz oscillator maintains real time in power save mode, allows the high frequency clock to be turned off
- Extensive DMA hardware support for data flow to reduce CPU load
- On-board 160 kB SRAM and 1 kB EEPROM eliminates need for external FLASH or RAM
- Internal Boot-ROM. This allows firmware to be downloaded into SRAM from the host
- Calibration data stored in internal EEPROM
- RoHS Compliant
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